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Both the static and fatigue strengths of electroplated copper thin films were measured under uni-axial stress. The mechanical properties such as the yield stress, fracture elongation and Young's modulus of each film were quite different from those of bulk copper depending on their micro structure. The fracture surfaces were observed by SEM after the fatigue test. It was found that there were two fracture...
We have applied high amplitude (~10 MA/cm2) alternating current (AC) at 100 Hz and direct current (DC) to copper interconnect lines with widths in the few-micrometer range covered with a thick layer of SiO2. Under our test conditions of Joule heating, the lines typically fail with lifetimes from 100 to 100,000 s, with a well-defined correlation between cyclic temperature range and the logarithm of...
Horizontal pulse-reverse plating system was employed for blind micro via (BMV) filling process. The reverse plating time, frequency, and current shape was controlled or modified to observe the influence factors on BMV filling and thickness uniformity. Pulse-reverse plating system can reduce the surface thicknesses and had good ability to filling high aspect hole. During reverse time plating, the etching...
Fine and ultra-fine powders are actively studied in a broad and interdisciplinary area of nanotechnology. This paper presents the complex of well-grounded solutions for direct production of nanopowders by the exploding wire method. The influence of initial conditions on the properties of powders is discussed. The basic factors are as follows: the level and the uniformity of heating, the heating rate,...
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