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This study focused on the effect of solder volume on the interfacial reaction between Sn3.5Ag0.75Cu solder balls and Cu pads on PCB after various reflow soldering times. The diameters of the solder balls were 200, 300, 400 and 500 μm, respectively, and the opening diameter of the Cu pads was 250 μm. The solder volume ratio for the 200, 300, 400 and 500 μm balls was approximately 1:4:8:16. The interfacial...
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