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In many electronic packaging applications, electrical insulation is required that can also provide high thermal conduction to appropriately couple a heat source to a heat sink. In these applications, it is the total thermal conductance, not the thermal conductivity, that must be maximized. This property is a result of both the bulk thermal conduction of the material as well as the nature of the interfaces...
In this work, the characteristics of silicone rubber (SiR) and epoxy composites prepared by using the electrospinning technique are compared with conventionally prepared composite materials. Both micron sized silica fillers and silica/aluminum nanofillers are used in preparing the composites. The technique of electrospinning was used to enhance the dispersion of nanofillers by embedding the fillers...
The high-density interconnection substrate invariably poses enormous difficulty to thermal design analysts due to complex metal layout patterns embedded in the dielectric matrix. A modeling method is proposed, which produces effective thermal conductivity values for elements of the substrate under a specified boundary condition. A novel parameter, the indexed metal volume fraction, is employed to...
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