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Thermal issues increase with the electronic industry pushing towards fast in high speed, high density, and high performance. Thermal conductive materials are strongly demanded for increasing heat dissipation and reducing operating temperature of devices. Hexagonal boron nitride (h-BN) nanosheet that owns high thermal conductivity and low coefficient of thermal expansion is a good filler candidate...
Thermal issues increase with the electronic industry pushing towards fast in high speed, high density, and high performance. Thermal conductive materials are strongly demanded for increasing heat dissipation and reducing operating temperature of devices. Hexagonal boron nitride (h-BN) nanosheet that owns high thermal conductivity and low coefficient of thermal expansion is a good filler candidate...
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