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Heat dissipation is an important issue in many electronic devices and therefore materials showing high thermal conductivity are required for their construction and packaging. The intrinsically low thermal conductivity of polymeric materials can be improved when employing (nano‐) composites; however, the required high filler content then renders these materials opaque. This paper reports on a composite...
Poly(vinyl alcohol) (PVA) composites with incorporation of Ag nanoparticle–reduced graphene oxide (Ag–rGO) hybrids as fillers were prepared and the thermal conductivity of the resulting Ag–rGO/PVA composites was investigated. Ag–rGO hybrids were fabricated by a chemical reduction method, and their morphology, crystal, and chemistry were characterized. Benefiting from the unique characteristic of Ag–rGO...
Epoxy resin systems are used in high voltage transformers, cable terminations, bushings, power apparatus, or insulation for X-ray tubes. They could be used more widely, but low thermal conductivity limits their applications. Polymers used as insulating materials generally lack the ability to dissipate excess heat efficiently. The aim of this study is to investigate the influence of different types...
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