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In many electronic packaging applications, electrical insulation is required that can also provide high thermal conduction to appropriately couple a heat source to a heat sink. In these applications, it is the total thermal conductance, not the thermal conductivity, that must be maximized. This property is a result of both the bulk thermal conduction of the material as well as the nature of the interfaces...
Friction linings were produced with varying particle sizes of palm kernel shell powder. The physical, mechanical and thermal properties of the manufactured friction linings were then determined in order to ascertain its performance and analyse the influence of pks particle size on these properties: the dimensions and the density were obtained following standard procedure; Poisson's ratio and Young's...
Electrical insulation materials with high thermal conductivity can protect equipment from heat fault and extend the working life of polymeric components. A nanodiamond/epoxy polymer network was developed based on surface modification of the nanodiamond. A simple oxidation strategy was used to modify the surface functional groups of the nanodiamond which were then mixed with epoxy resin in solution...
Thermal issues increase with the electronic industry pushing towards fast in high speed, high density, and high performance. Thermal conductive materials are strongly demanded for increasing heat dissipation and reducing operating temperature of devices. Hexagonal boron nitride (h-BN) nanosheet that owns high thermal conductivity and low coefficient of thermal expansion is a good filler candidate...
Thermal issues increase with the electronic industry pushing towards fast in high speed, high density, and high performance. Thermal conductive materials are strongly demanded for increasing heat dissipation and reducing operating temperature of devices. Hexagonal boron nitride (h-BN) nanosheet that owns high thermal conductivity and low coefficient of thermal expansion is a good filler candidate...
The high-density interconnection substrate invariably poses enormous difficulty to thermal design analysts due to complex metal layout patterns embedded in the dielectric matrix. A modeling method is proposed, which produces effective thermal conductivity values for elements of the substrate under a specified boundary condition. A novel parameter, the indexed metal volume fraction, is employed to...
Thermally conducting and effectively electrically insulating nanocomposites for thermal interface applications were developed by dispersing graphite nanoplatelets (GNP) into a silicone matrix by dual asymmetric centrifuge mixing. Thermal conductivity, electrical conductivity, compression and hardness properties of the resulting composites were measured. The effects of GNP particle size and wt.% of...
Epoxy resin systems are used in high voltage transformers, cable terminations, bushings, power apparatus, or insulation for X-ray tubes. They could be used more widely, but low thermal conductivity limits their applications. Polymers used as insulating materials generally lack the ability to dissipate excess heat efficiently. The aim of this study is to investigate the influence of different types...
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