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Interfacial fracturing is the most important failure mode of solder joints. In this paper, interfacial stresses of Cu pad/solder interfaces are evaluated based on the theory of interfacial mechanics and the finite element method. Effects of solder joint shapes and solder materials on the stress intensity are investigated. The results show that Sn37Pb/Cu interface has greater stress intensity than...
The effect of thinning down the chip thickness, will affect the stress pattern in the chip and causes the chip to deform locally when the thickness of the chip is thinner than a certain critical value. Such a local deformation may cause sharp gradient of residual stress around the solder bumps and thus, various failures. This paper shows that by considering the effect of solder bumps on a 50 mum chip,...
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