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Use of lead-free solders such as Sn/Ag/Cu results in exposure of printed circuit boards to higher temperatures during assembly compared with eutectic tin-lead solder. If the thermo-mechanical and electrical properties of the laminate materials get affected by exposure to this higher temperature, that may impact the performance and reliability of the circuit board. Variations, if any, in laminate material...
Recently, high frequency has been broadly applied in communication and broadband technologies, and even mini-electronic devices. Signal propagating delay and signal transmitting loss in PCB is strongly relevant to frequency range at high frequency. Therefore, dielectric properties of laminate material are more and more concerned. Additionally, lead-free solder process application for PCB/PCBA has...
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