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New method of residual stress measurement is established and expressions are inferred based on reverse deduce. Test results show that residual stress in the upper layer presents as tensile stress, while presents as compressive stress in the transition zone between laser cladding and substrate.
This work reports the development of very low residual stress and low strain gradient polycrystalline SiC (poly-SiC) thin films deposited by low pressure chemical vapor deposition (LPCVD). Using dichlorosilane (DCS, SiH2Cl2) and acetylene (C2H2) as precursors, it was found that the flow rate of DCS can be used to adjust the residual stress from tensile to compressive in as-deposited films. The resulting...
We report on the structural and electrical characterization of Mo thin films deposited at room temperature by RF magnetron sputtering. The effect of RF power on the morphology and residual stress of the films is analyzed. The films are under compressive stress and consist of densely packed columns with a lateral size on the order of 20 nm. The stress, critical temperature, and resistivity of the films...
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