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The effects of the intermetallic compound (IMC) microstructure on the tensile strength and the fracture behavior of Sn3.5Ag0.5Cu/Cu solder joints are investigated. The soldered samples are isothermally aged at 150 °C for 0, 72, 288, 500 hours, respectively, and then are tested at the strain rate of 2×10−4 s−1 at room temperature in air. The experimental results show that with the increase of the isothermal...
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