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This paper reports the findings supporting that solder joint grain structure within an assembly is not fixed but varies with the joint location and cooling rate. Also reported is the fact that such change in grain structure can make the joint fatigue resistance to be increased. These conclusions are made by comparing the grain structure and fatigue kinetics of the joints in BGA assembly with variation...
This paper reports experimental evidences suggesting that fracture resistance of solder joints in packaging assembly is not necessarily uniform but can vary significantly with their locations in the assembly. Specifically, it is found that the solder joints located at the chip corner is much more prone to the fracture under thermo-mechanical or mechanical loads such as vibration and shock. This, the...
The elastic, thermal expansion, and plastic anisotropy of Sn is examined to assess how anisotropy affects the microstructural evolution and damage nucleation processes in SAC305 solder joints. Examination of all joints in a package indicates that upon solidification, crystal orientations are nearly randomly distributed. Initial studies of cracked joints after thermal cycling showed that orientations...
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