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Requirements for system availability for ultrahigh reliability electronic systems such as airborne and space electronic systems are driving the need for advanced health monitoring techniques for the early detection of the onset of damage. Aerospace electronic systems usually face a very harsh environment, requiring them to survive the high strain rates, e.g., during launch and reentry, and thermal...
Interfacial delamination is one of the primary concerns in electronic package design. Pop-corning in plastic-encapsulated IC packages is a defect frequently occurring during the solder reflow due to moisture penetration into the packages. Moisture absorption has a detrimental effect on the EMC/Cu interfacial adhesion and drastically reduces the reliability of the encapsulated package. To obtain good...
In this paper, finite element analysis (FEA) was used to evaluate the stress distribution on quad flat no-lead (QFN) packages. Different models were established, including moisture diffusion, thermo-mechanical stress, hygro-mechanical stress and hygro-thermo-mechanical stress models. The transient moisture absorption and desorption analysis were performed to estimate the package moisture distribution...
Information processing has been thought of as a key to ubiquitous systems. Operating systems composing ubiquitous systems are also important since ubiquitous systems do not provide desired performance when the operating systems fail. Bluetooth module becomes a critical item for these operating systems. Thus, accurate reliability estimation of the module under various environmental conditions is required...
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