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In the context of the emerging 3D integration paradigm, chips are built as stacks of several (likely heterogeneous) 2D layers. The topology of their communication network is quite irregular, mainly due to the different topologies of the 2D layers and the partial vertical connection between these layers. In this paper, a reconfigurable inter-layer routing mechanism (RILM) for such topologies is proposed...
3D IC technology drives Network-On-Chip (NoC) design on towards 3D trend and relevant multi-core system further development. However, most recent researches still focus on the fundamental 3D Mesh structure and have no convincible traffic pattern models in realistic applications. In this paper, we p resent a complete design framework of a Distributed Shared Memory homogenous multi-core system based...
Rectangular mesh and torus are the mostly used topologies in network-on-chip (NoC) based systems. In this paper, we quantitatively illustrate that the honeycomb topology is an advantageous design alternative in terms of network cost which is one of the most important parameters that reflects both network performance and implementation cost. Comparing with the rectangular mesh and torus, honeycomb...
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