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Sine waveform AC skin effect of lead-free Sn95.5%Ag4.0%Cu0.5 (SAC405) solder joints was investigated experimentally. It was found that 1 MHz is critical frequency above which skin effect becomes essential for lead-free solder joints. Since our concerned frequency in this study is far below 1 MHz, skin effect is not ignored in computer simulations. Sine waveform alternating current (AC) was used to...
The in-situ measurement of the stress evolution at the anode and cathode interfaces of the Cu/3.0Ag0.5Cu/Cu solder joints with current density of 4 × 103A/cm2 at room temperature by X-ray diffraction technique was investigated. The experimental results showed that the stress evolution at the interfaces was a very complicated process during current stressing, which owed to many influencing factors...
A frequent cause of failure of portable and hand-held devices is an accidental drop to the ground. The effect of electromigration on the mechanical properties of solder joints was discussed in this paper. Without current stressing, the samples were broken in the bulk of solder or at the interface of Al interconnect and solder. if the Al-solder interfacial mechanical strength was improved by changed...
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