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In this work, we present an effective method to analyze and predict the performance of a pair of differential via through multilayered printed circuit boards (PCBs). A pair of differential vias can be modeled as twin-rod transmission lines in a circuit model. By applying the equations for characteristic impedance in a circuit simulator, this model can quickly and effectively predict the behavior of...
The modern telecommunication equipments consist of boards connected by thick backplanes where differential traces on different layers transmit high speed digital signals. These signals switch from different layers by means of plated through holes that, when not used, are stubs introducing dips on the insertion losses of the used traces. The paper presents an algorithm for modeling differential vias...
The modelling and simulation of crossing striplines in printed circuit boards (PCBs) or multichip modules (MCMs) are presented in this paper by employing the boundary element method (13EM) to compute the per unit length capacitance, inductance, and resistance matrices. These parameters are then used to compute the cross-talk on the passive striplines generated by propagating waves on the driven striplines...
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