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The solid-state interfacial reactions of Pb-free solders (Sn-3.5Ag, Sn-3.5Ag-0.7Cu, and Sn-0.7Cu) with electroless nickel-immersion gold (ENIG)-plated Cu substrate, and the growth of interfacial intermetallic compound (IMC) layers were investigated and compared during aging at 200??C for up to 1000 h. The Sn-3.5Ag-0.7Cu solder exhibited a higher IMC growth rate and a higher consumption rate of the...
In this paper, Sn-Ag-Cu-Mg lead-free solders based on an eutectic Sn-Ag-Cu alloy were prepared by means of uniform design. Further investigations were carried out in aspects of melting, wettability, thermal stability and other physical properties employing differential thermal analysis (DTA), X-ray diffraction (XRD), etc. It is showed that the melting temperatures decrease when the element of Mg was...
Environmental and health concerns with Pb have led to development of lead-free solders to replace commercial Sn-Pb solders in electronic packaging applications. Sn-3Ag-0.5Cu solder is one of the solders applied to both the reflow soldering process and the wave soldering process. However, its melting temperature is about 30 K higher than that of Sn-Pb eutectic, so the temperature on the soldering process...
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