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In this paper, silicon (Si) chips were bonded to 304 stainless steel (304 SS) substrates using silver-indium (Ag-In) binary system without any use of flux. 304 SS substrates were also bonded to 304 SS substrates to develop a low-temperature fluxless process to seal two 304 SS parts together. In the bonding design, Ag and In were deposited separately in a layered structure. Various processes and solutions...
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