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This paper introduces a package of a high-speed and high-density switching ASIC with over 1000 pins and hundreds of high-speed transmission lines crowded in two layers of the substrate, and also demonstrates Signal Integrity (SI) and Power Integrity (PI) implementation. In order to route the transmission lines with minimum distortion, crosstalk and attenuation, routing is co-designed with die and...
Advances in micromachining technology can facilitate the integration of SAW (Surface Acoustic Wave) devices and CMOS circuitry on IC scale substrate for Monolithic fabrication. The optimal design and performance of these filters can be reached by using new Smart materials. The key component in the structure of the SAW device is the piezoelectric materials used which depends mainly on some important...
The number of domain walls and the domain wall velocity of very thin (110) [001] 3% Si-Fe strip-wound cores were observed by SEM at excitation frequencies up to 5 kHz. Eddy current losses were calculated on the basis of the dynamic domain behavior using two models. a modified Pry and Bean model, and a model which considers the difference between each domain wall velocity. Both models assume sinusoidal...
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