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Channel Hot Carrier (CHC) and Negative Bias Temperature Instability (NBTI) degradation has been studied in pMOSFETs with and without channel strain. The results show larger CHC degradation and a neglegible influence of NBTI on strained pMOS devices. The degradation effects are modeled to be introduced in a circuit simulator. The simulations of a CMOS inverter, which has been chosen as example circuit,...
We present the reliabilities in compressively strained SiGe channel pMOSFETs. A Si capping layer in SiGe channel pMOSFETs improved the negative bias temperature instability (NBTI) without device performance degradation. Also, the Si capped device exhibits the better NBTI reliability than the Si channel device. Because a Si capped structure forms the double barrier layer in the interface, it is the...
In this paper, we demonstrate TaN/fluorinated HfO2 CMOS devices, focusing on symmetry and asymmetry fluorine incorporation at top or bottom HfO2 interfaces. 16% permittivity enhancement, 65% and 91% mobility increases for electron and hole, respectively, under high electric field was achieved. Reliability of n- and p-MOSFET was improved 3 orders and 8% for GIDL and hot carrier immunity, respectively...
A systematic study of mobility performances and BTI reliability was done in advanced dielectrics stacks. By reducing the oxide films thicknesses THKles2.5 nm, PBTI becomes generally very low and associated lifetimes are always over 10 years. By studying a large variety of dielectric stacks we also clearly demonstrate that mobility performances, interface defects Nit and NBTI reliability are strongly...
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