The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper mainly studied the heat dissipation of the heat sink placing on the level of the natural convection cooling conditions by numerical simalation.lt is found that on the conditions of the same width of the heat sink , the power of convection heat dissipation of heat sink can't be increased by reducing spacing of fins(representing an increase of the number offins of heat sink ). By comparing...
The micro-pin-fins prepared on the back side of the power chip enable heat removal on the level of modern microsystem demands. Carbon nanotube (CNT) has been proven to be a potential material for micro-cooler because of its superior advantages including high thermal conductivity, good mechanical property and so forth. And there emerges various applications of CNT in the micro-cooler system. In the...
Higher packaging density is driven by the multi-functional requirements and size shrinkage in handheld applications, which was greatly improved by the 3D packaging technologies. Package-on-package (POP) is one of the 3D packaging solutions. In the POP, the package components can be fully tested good prior to integration. However, the structure of POP is much more complex than that of single package...
A kind of Two-phase Closed Loop Thermosyphon (TCLT) which dissipate heat of electronic device was fabricated. The TCLT was composed of an evaporator, a condenser, a subcooler and connecting tubes. The most important part, the Enhanced Boiling Microstructures (EBMS) of evaporator, of the TCLT was studied. Three kinds of EBMS for nucleate boiling heat transfer were design. Pool boiling experiments were...
It is well-known that the performance and reliability of integrated circuits and other electronics are functions of operating temperature. The accurate prediction of temperature distributions for such applications poses engineering challenges due to many factors, including complex convection flows, non-uniform thermal boundary conditions, extrapolation to operation in extreme environments, and demanding...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.