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Quadrate Flat Package (QFP) is chosen as package mode of chip for typical Hall-effect current sensors. In this paper, taking the deformation behavior of QFD structure under the temperature loading into consideration, according to related physics laws such as Fourier heat transfer law, Stephen-Boltzmann law and Newton's law of cooling, the thermal simulation of packaging for current sensor is implemented...
Failures caused by the electromigration (EM) are becoming a primary reliability concern of integrated circuits and electronics packaging designers and manufacturers. In the foreseeable future, the trend of greater scale integration and further miniaturization in the microelectronics industry is expected to continue and this will make the metallization in electronics devices more susceptible to EM...
The impact of STI stress with layout dependency on circuit performance is investigated. A 3D stress simulator has been developed using finite element method, which considers both the layout design and process information (PDK). The mobility change due to stress is included in the transistor modeling for circuit simulation. The circuit performance can thus be analyzed with nonlocal stress. As a test...
A synthesis and optimization process is proposed and applied to the design of a specific MEMS device, namely an acceleration sensor. The design synthesis methodology exploits the fast and accurate simulation of the SUGAR tool (based on modified modal analysis) along with the full simulation capability of ANSYS (based on the finite element method). A three degrees-of-freedom piezoresistive acceleration...
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