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This paper deals with presentation of some new aspects of solder ternary alloy 96.5Sn3Ag0.5Cu (wt.%) - SAC305, in order to determine variations in mechanical properties and microstructure caused by treatment in vapour phase soldering (VPS) as well as by accelerated isothermal aging. These specimens have been melted and solidified on HASL (hot air solder levelling) and Ni/Au (ENIG) PCB (printed circuit...
The study focuses on a particular solidification phenomenon found in SnAg3.0Cu0.5 solder balls. Investigations on the microstructure of as cast solder spheres showed, that there is an abrupt change in grain structure during solidification. The microstructure of these specimen consists of areas with small grains that are surrounded by large areas with major grain orientations. In order to characterize...
The scope of this study is to investigate the influences on the solidification of the micro structure of SnAgCu solders. It will be shown that the solidification process depends on solder composition, specimen size and manufacturing conditions. The influence of solder composition has been investigated on bulk solder ingots by varying the Ag content from 3.0 wt% to 3.8 wt% and the Cu content from 0...
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