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Resin diamond grinding wheels are applied to the back thinning grinding (back grinding) of IC silicon wafers. The wheels should have very high performance because the silicon wafers ground by them can reach nano-scale roughness, micron-scale damage layer thickness and micron-scale surface type accuracy. The depth of subsurface damage and Ra value of subsurface roughness are two important indicators...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.