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Ultra low-k (ULK, k=2.4) dielectric has weaker mechanical properties than first generation low-k films (k=3.0). The introduction of ULK into advanced back end of lines (BEOL) presents a significant challenge due to chip package interaction (CPI) where the packaged die is cycled over a temperature range and the resulting stress can cause ULK BEOL delamination. To avoid CPI failure detailed modeling...
Wire pull tests are generally conducted to assess the wire bonding quality. Using Cu/low-k technology, two failure modes are usually observed: Failure in the neck of the wire (neck break) and metal peel off (MPO). The objective of our study is to investigate the root cause of metal peel off by using a combined experimental and numerical approach. First, dedicated failure analyses are conducted to...
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