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A primary factor of ACF package failure is delamination between the chip and the adhesive at the edge of the chip. This delamination is mainly affected by the normal strain at the edge of the chip. This normal strain was measured on various electronic ACF package specimens by micro Moireacute interferometry with a phase shifting method. In order to find the effect of moisture, the reliability performance...
Ultra low-k (ULK, k=2.4) dielectric has weaker mechanical properties than first generation low-k films (k=3.0). The introduction of ULK into advanced back end of lines (BEOL) presents a significant challenge due to chip package interaction (CPI) where the packaged die is cycled over a temperature range and the resulting stress can cause ULK BEOL delamination. To avoid CPI failure detailed modeling...
Wafer level chip scale packaging (WLCSP) has some advantages, such as real die size packaging, high electrical performance, and low manufacturing cost. However, because the mechanical reliability of a large die can not be guaranteed due to the coefficient of thermal expansion (CTE) mismatch between silicon and organic printed circuit board (PCB), WLCSP technology is still not fully accepted. We have...
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