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Structural defects in the rotor cage of large electrical machines significantly impact their expected operational lifetime. This work simulates the stresses developed in a damaged rotor cage during different transient profiles and for different sizes of the imperfection. A combined model featuring electrical, thermal and mechanical stages as well as three different meshes reflecting a progressing...
Stator inter-turn faults are among the most important electric motor failures as they progress fast and lead to catastrophic motor breakdowns. Inter-turn faults are caused due to the windings' insulation degradation. The main stress which deteriorates the insulation is the thermal one. Proper understanding of how this stress influences the electrical properties of insulation over time may lead to...
A GaN-on-Si power device is a strong candidate to replace power components based on silicon in high-end market for low-voltage applications, thanks to its electrical characteristics. To maximize opportunities of the GaN device in field applications, a package technology plays an important role in a discrete GaN power device. A few specialized package technologies having very lower stray inductance...
This paper presents a reliability analysis and life testing of semiconductor devices for in-wheel motor (IWM) drive system in automotive applications. Considering practical factors such as vehicle lifetime requirements, a novel drive cycle is proposed to examine and assess the semiconductor reliability of a two IWM-driven vehicle. Based on the evaluated thermal profile of the device junction, the...
Multilevel Inverters play key role in grid integration of photovoltaic (PV) systems. Although power semiconductor devices in multilevel inverters represent the most expensive and vulnerable parts according to the recent reliability surveys. Thermal stresses in power semiconductor devices represent the main cause of their failures. Therefore, improved controllers with lower thermal stresses are highly...
The paper aim is to analyze the way in which the electrical load influences the infrared thermal images of the thermal stresses of electrical equipment determined by using infrared thermography devices. In order to obtain a reliable result of the infrared investigations several conditions must be accomplished, such as good definition of the correction parameters and choosing the optimal environmental...
With BDS receiver widely used in many fields, it faced some problems such as wide range of dynamic stress and thermal noise interference which caused by receiver racing and thermal shock of electrons in the process of tracking. Conventional receiver increase the bandwidth to expand the dynamic stress range, but it caused more thermal noise getting into the loop so that tracking accuracy decreased...
The tungsten-rhenium thin film thermocouples (TFTCs) sensor is designed and optimized based on mechanical properties analysis, the process is optimal designed and the experiment shows the working hours of TFTCs sensor with optimal increasing from 10 minutes to 300 minutes at 900K, and the total work time reach to 600 minutes with a better output voltage when compared with our previously published...
Thermal greases allow a low stress bond at low bond line thicknesses (BLT) at medium thermal conductivities and simple application, all of which make it an alternative to solders, thermal adhesives or pads. It is widely used in power and microprocessor applications, most of which involve large areas to be used for heat transfer. However, for years thermal overload failure of power modules and chips...
The underlying variability in the ReRAM device operation, while undesired in many applications, can be advantageous for hardware security primitives. ReRAM devices also come with the advantage of having non-linear multi-state operation. By comparison with previous reported ReRAM PUFs, which utilized spatial variations in the devices' binary ON/OFF states, we proposed to use sneak path currents and...
This paper studies the impact of the accelerated thermal aging on the conducted emission produced by a synchronous buck converter. The most degraded devices mounted on the DC-DC converter are identified and modeled in order to simulate the evolution of conducted emission and anticipate risks of non-compliance to emission requirements.
Silver tin oxide (Ag/SnO2) contact materials are widely used in contactor applications. A general trend in this application field is the steadily ongoing miniaturization of switching devices, resulting in growing energy densities to be handled by the contact system. The higher arcing energy densities in such new designs are inducing increased thermo-mechanical stresses in the contact system. As these...
High voltage cables are used worldwide to transmit electric power in special cases such as underground and underwater, where the overhead lines can't be used. Polymeric cable insulation is most commonly used for high voltage applications due to its several advantages like maintenance free when compared to oil impregnated paper. As well known, insulation is the very important concern in high voltage...
Degradation behavior of thin-film Si photovoltaic modules by hygrothermal and thermal cyclic stresses was studied. Degradation progresses along the scribe lines for integration and from the slit on back sheet for taking out interconnector ribbons. Not only acetic acid generated by hydrolysis reaction between ethylene-vinyl acetate encapsulant and penetrating water vapor but also water vapor itself...
Structural reliability issues attract more and more attentions with the rapid development of electronic packaging industry. Sn-Ag-Cu alloys have long been used as solder materials for the interconnections of microelectronic devices because of low melting temperature and good wettability. Many tensile tests were performed on Sn-3Ag-0.5Cu solder alloys at various strain rates and over a wide temperature...
The purpose of this paper is to study the temperature effect on the Print Circuit Board (PCB) and the solder joints in the vehicle under working condition of the engine. Thermal-stress test has been used to evaluate the reliability or fatigue life of the PCB using commercially available Finite Element Analysis software, ANSYS. The thermal deformation distribution of the PCB and stress of the solder...
In this paper, finite-element models were developed to calculate the elastic fields within both solder and Cu-pillar bumps under the influences of thermal stresses and Joule heating. First, a steady-state equation of the electric potential is solved to determine the electric field and thus, the effect of Joule heating. Then, the temperature field is obtained by solving a steady-state equation of thermal...
The effect has been examined of Cu-Filled TSV under thermal shock test. The mismatch in the coefficients of thermal expansion between Cu metal and Silicon generates the thermal mechanical stress. The stress plays critical effect on the performance of the device structure and generates cracks. The Cu metal volume increase and separate from Si matrix after thermal shock test. The Cu metal drift can...
Standard design passivation layers on thick (> 3000 nm) top metalization has a susceptibility for cracking due to thermal stress. In this two part series of papers, Finite Element Analysis (FEA) simulation with Comsol Multiphysics was used to understand the impact of thermal stress. In Part I (this paper), three different thermal stress conditions were investigated i.e. cool down after Chemical...
The reliability of electronics products has become a serious problem due to the increasingly harsh environmental conditions when the products are in use. Due to demand on greater performance and higher integration in microelectronic devices, the electronics industry has been seeking suitable components, packaging and cooling techniques to achieve low-cost and high-reliability. This paper presents...
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