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The anodic bonding technology has been widely utilized in the packaging of the microelectromechanical systems (MEMS), but its relatively high bonding temperature, sometimes relatively weak bonding strength due to micro-bubbles generated along the bonding interface prevent its wider application. In this paper, the studying results demonstrate that can improved bonding strength to carry out the bonding...
Pressure sensing is one of the mostly performed measurement encompassing varieties of applications. The latest technology such as silicon based Micro-electromechanical Systems (MEMS) technology is favoured due to its competitive cost and proven performance. In our research, MEMS pressure sensor for biomedical application is investigated. There are a number of stages involved in our research for implementation...
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