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Miniaturisation of electronic devices and the RoHS directive have made the use of solder joints challenging. Thus, new methods for attachment of chips have been developed, such as adhesive attachments. Moisture is the principal cause for failures in these attachments. The effects of moisture to non-conductive adhesive attachments were studied by modeling with finite element method and by environmental...
The interface crack caused by moisture absorption is a main reason for the failure of plastic packaging electronic devices. According to the failure of interface cracks in QFN plastic packaging devices caused by hygro-thermal environment, the paper combining with finite element method (FEM), carried on the research by moisture absorption experiment, lead-free reflow soldering experiment, high temperature...
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