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We report on recent experimental studies performed as part of a 3D integrated circuit (3DIC) production-worthy process module roadmap check for 300 mm wafer-to-wafer (WtW) copper-to-copper thermocompression bonding and face-to-face (F2F) aligning. Specifically, we demonstrate submicron alignment capabilities (3sigma alignment variability ~ 1 μm) post Cu bonding on topography M1V1-to-M2 Cu wafers with...
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