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A wise network planning becomes the most important phase in determining the network efficiency. In this paper we consider the wireless mesh network (WMN) planning problem where no much work has been done. We propose a new multi-objective optimization model for planning WMNs, where the two conflicting objectives, namely network deployment cost and network channels' interferences, are simultaneously...
This paper discusses the design of a 60 GHz low noise amplifier (LNA) using a standard low power SOI CMOS process from ST Microelectronics. First, we outline the technology as well as the mm-wave design challenges. Using recent work on coplanar waveguide (CPW) modeling, we describe how it's possible to use parametric, 3D electromagnetic simulation to complete or replace analytical models of on-chip...
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
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