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The technology of through-silicon vias (TSVs) enables fine-grained integration of multiple dies into a single 3-D stack. TSVs occupy significant silicon area due to their sheer size, which has a great effect on the quality of 3-D integrated chips (ICs). Whereas well-managed TSVs alleviate routing congestion and reduce wirelength, excessive or ill-managed TSVs increase the die area and wirelength....
With the extensive research on through-silicon-via (TSV) and die-stacking technology from both academia and industry, mainstream production of 3D ICs is expected in a near future. However, power delivery is believed to be one of the most challenging problems in 3D ICs. A main objective of the 3D power/ground (P/G) network optimization is to minimize the usage of P/G TSVs while satisfying power supply...
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