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In this study, the high dielectric constant of the polymer/ceramic composites is used to fabricate capacitive substrates. The reliability and failure analysis of the capacitive substrate under temperature and voltage stress have been studied. The mean time to failure (MTTF) of the capacitive substrate shows a voltage exponent value dependence on applied voltage with a constant of ≃3.3 as the measurement...
Fixed RF resistor based on AlN substrate and RuO2 resistive film investigated. AlN substrate is most commonly used material for high power RF resistor recently because of low dielectric loss, high thermal conductivity and environmental problem. RuO2 based resistive film is also most widely used resistive film material because of low TCR and chemical stability. But low adhesion strength to AlN substrate...
Due to the advantages of small-footprint, short-lead, high performance, high-packaging-density and thin profile, flip-chip-on-board (FCOB) technology is becoming an attractive choice in todaypsilas high density electronic packaging industry. With the trend toward lead-free and miniaturization in consumer electronics, the fatigue reliability of the small size lead-free FC solder joint on low cost PCB...
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