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A new wafer-level process to precisely fabricate regular arrays of deep cavities on the Pyrex7740 glass wafer as well as applications to wafer-level hermetic packaging of MEMS devices are presented. The process is based on the anodic bonding, and the Si substrate is employed as a mold layer to form the shape of the cavity. The appropriate processing parameter is obtained from a series of experiments...
We present a two-staged BCB- and anodic-bonding-based packaging approach used to package both a 3-axis piezoresistive accelerometer and an absolute pressure sensor both based on the same CMOS/SOI process with integrated on-chip amplification. A number of electrical connections run from the sensing element and the integrated amplification circuitry to the bond-pads, crossing the area used for the bond...
In the field of manufacturing of micro-system, the Pyrex7740 glass is a widely-used material since its coefficient of thermal expansion is similar to that of silicon and it has good optical performance for optical sensors and actuators. The use of Pyrex7740 glass is limited by its isotropic etching characteristic. In this paper, a new wafer-level process to precisely fabricate deep cavities on the...
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