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Pressure sensing is one of the mostly performed measurement encompassing varieties of applications. The latest technology such as silicon based Micro-electromechanical Systems (MEMS) technology is favoured due to its competitive cost and proven performance. In our research, MEMS pressure sensor for biomedical application is investigated. There are a number of stages involved in our research for implementation...
We present a two-staged BCB- and anodic-bonding-based packaging approach used to package both a 3-axis piezoresistive accelerometer and an absolute pressure sensor both based on the same CMOS/SOI process with integrated on-chip amplification. A number of electrical connections run from the sensing element and the integrated amplification circuitry to the bond-pads, crossing the area used for the bond...
Micromachining is an extended IC fabrication based on photo-fabrication, deep etching, anodic bonding and other advanced process technologies. This is used to produce MEMS (Micro Electro Mechanical Systems) featuring multi-functions, small size and low cost. Nanostructures such as CNT (Carbon Nano Tube) can be also included in the MEMS by nanomachining. MEMS are used as value added key components...
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