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This paper presents a novel silicon micromachining method, which combines tetra methyl ammonium hydroxide (TMAH) etching and deep-reactive ion etching (DRIE) along with bottom-up copper electroplating, to fabricate high-density and high-aspect ratio through-wafer electrical interconnects (TWEIs) for three-dimensional multichip packaging. The silicon wafer was locally etched with TMAH from the backside...
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