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The present work further develops the microbridge testing method to characterize mechanical properties of bilayer thin films. We model the substrate deformation with three coupled springs and consider residual stress in each layer to formulate deflection versus load under large deformation, resulting in a closed-form formula. If the mechanical properties of one layer are available, the closed formula...
A novel microbridge testing method for thin films is proposed. Theoretic analysis and finite element calculation are conducted on microbridge deformation to provide a closed formula of deflection vs load, considering both substrate deformation and residual stress in the film. Using the formula, one can simultaneously evaluate the Young's modulus, residual stress and bending strength of thin films...
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