The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The temperature dependences of dielectric permittivity and elastic modulus of poly(vinylidene fluoride - hexafluoropropylene) (P(VDF-HFP)) are compared and explained by use of structural data obtained by differential scanning calorimetry and X-ray analysis. Special emphasis is put on the effect of uniaxial stretching which renders the polymer ferroelectric. It is shown that dielectric and mechanical...
Apart from its chemical structure, mechanical properties of polymers depend mainly on polymer morphology, which is determined by the processing conditions. Exposure of the materials at elevated temperatures lead to changes in polymer morphology. The main objective of this study was to investigate the change in thermo-mechanical properties of different encapsulation materials (EVA, Ionomer) after damp...
A novel flexible electrically conductive adhesive (FECA) has been designed for electronic interconnect applications that require high flexibility on the flexible substrates and connectors. The physical properties of the resulting ECAs such as the elastic modulus, glass transition temperatures, adhesion strength and electrical properties were characterized by differential scanning calorimetry (DSC),...
This paper presents the results of the thermal, mechanical and dielectric measurements conducted on polymer nanocomposites consisting of epoxy and polyhedral oligomeric silsesquioxane (POSS). The material composites were analyzed with a scanning electron microscope (SEM), an atomic force microscope (AFM) and a transmission electron microscope (TEM). Glass transition temperatures of the composites...
Fiber-reinforced composites are used as insulating layers in PCBs to reduce thermal residual stress and warpage due to their low coefficient of thermal expansion (CTE) and high elastic modulus. The composite prepreg is laminated on patterned copper layers by hot-press molding process to apply temperature and pressure cycles. In this study, the lamination process of glass/epoxy woven composite in the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.