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The deluge of date rate in today’s networks imposes a cost burden on the backhaul network design. Developing cost-efficient backhaul solutions becomes an exciting, yet challenging, problem. Traditional technologies for backhaul networks, including either radio-frequency (RF) backhauls or optical fibers (OF). While RF is a cost-effective solution as compared with OF, it supports the lower data rate...
Printed circuit board (PCB) design and manufacturing has traditionally used heavy copper layers within the board as a method of dissipating heat loads from high performance, high heat-generating devices mounted on the boards. These copper layers add substantial weight, have a very high coefficient of thermal expansion (CTE) in relation to other board fabrication materials and the semiconductor devices...
The copper interconnects cannot keep pace with the IC interconnect requirements as the feature size continues to scale down to nanoscale. Theoretical works predicted that carbon nanotube (CNT) is more superior than copper for future VLSI interconnects in terms of electrical conductivity, thermal management and reliability. Technology breakthroughs are required to bridge the gaps between the theoretical...
Radar sensors are already employed in production model vehicles e.g. for adaptive cruise control (ACC) systems. Further development of driver assistance systems has also led to the use of radar sensors in active safety systems (active brake assistance, collision warning, emergency braking, etc). However, the costs of manufacturing such radar-based systems, capable of gathering reliable information...
There is an ongoing demand for low cost high performance RF components for high frequency applications. Current packages for this domain use plastic packages based on wirebonding. The RF performance is limited by parasitic effects due to the RLC network between the wirebond from the dies to the leadframe. One of the best ways to reduce these effects is the use of flip chip technology. Flip chip interconnections...
In this work we modeled and simulated through silicon vias (TSV) in low, medium and high resistivity silicon (LRS, MRS and HRS) for frequencies up to 80 GHz. We then quantified the electromagnetic reliability (EMR) problems caused by conventional TSVs, in which silicon is used entirely as the medium for wave propagation. Our results revealed that using these conventional structures leads to high insertion...
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