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This paper presents principles and results of dynamic testing of an SRAM-based FPGA using time- resolved fault injection with a pulsed laser. The synchronization setup and experimental procedure are detailed. Fault injection results obtained with a DES crypto-core application implemented on a Xilinx Virtex II are discussed.
For several decades, the output from semiconductor manufacturers has been high volume products with process optimisation being continued throughout the lifetime of the product to ensure a satisfactory yield. However, product lifetimes are continually shrinking to keep pace with market demands. Furthermore there is an increase in dasiafoundrypsila business where product volumes are low; consequently...
The dramatic increase in leakage current, coupled with the swell in process variability in nano-scaled CMOS technologies, has become a major issue for future IC design. Moreover, due to the spread of leakage power values, leakage variability cannot be neglected anymore. In this work an accurate analytic estimation and modeling methodology has been developed for logic gates leakage under statistical...
In this paper we discuss some aspects of antennas in real designs in SOI technology, and show how the concepts manifest themselves in actual chips, where second-order effects such as resistance and the details of the processing sequence can play an important role. We also discuss the ramifications of a more recent technique which inserts bulk contacts into the SOI design, thereby imposing a bulk-like...
Novel 3D stacked gate-all-around multichannel CMOS architectures were developed to propose low leakage solutions and new design opportunities for sub-32 nm nodes. Those architectures offer specific advantages compared to other planar or non planar CMOS devices. In particular, ultra-low IOFF (< 20 pA/mum) and high ION (> 2.2 mA/mum) were demonstrated. Moreover, those transistors do not suffer...
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
The increasing ubiquity of mobile embedded systems has been matched by the evolution of a variety of wireless network standards and technologies. The major constraints of wireless embedded systems are limitations of communication bandwidth, processing capabilities, and battery power. Remote wireless embedded systems often act as sensors, which provide data to a certain community. The exchange of data...
We designed and built a novel all-optical re-timing, re-amplifying, and re-shaping (3R) regeneration system based on terahertz optical asymmetric demultiplexers (TOADs) developed in our laboratory. The system is capable of parallel processing multiple wavelengths, a feature which will significantly improve the scalability of current wavelength division multiplexing (WDM) networks. Performance against...
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