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An and model was used to establish the constitutive equation of SnAgCu solder, the stress-strain response of soldered joints was analyzed by finite element code. Results indicated that the stress concentrates on the sharp corner of interior part of outermost soldered joint, where is the weakest position at which cracks initiation take place easily and lead to failure owing to thermal fatigue finally...
In this paper, the damage fracture of solder joints in board level electronic package subjected to drop impact loadings was numerically simulated by the finite element method and the cohesive zone model. The solder-Cu pad interface was modeled by cohesive zone elements. The results show that fracture initiates at the edge of the PCB side and the damage of solder joint is affected greatly by the used...
The thermomechanical fatigue of solder joints on the system level is more complex to predict than on the board level. The damage of the solder joints of an electronic device in an ECU (electronic control unit) depends on the thermal expansion mismatch between the materials of the device and the PCB (printed circuit board), so called local mismatch, as well as on the global deformation of the PCB induced...
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