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Electronic packages subjected to drop and shock have been simulated using alternative theory known as peridynamic theory in the realm of FEM. In peridynamics, problems are formulated in terms of integral equation which is a substitute to conventional solid mechanics theory where problems are formulated in terms of partial differential equations. This alternative approach is more potent than conventional...
To study the relation between the QFP lead-free solder stress and strain accumulation under the condition of the impact of temperature (-55??C~125??C), Visco-plastic finite element model based upon Anand constitutive equations is established to numerically analyze the interfacial stress of solder formed by three different kinds of solders to the same substrate FR-4. The results shows that the interface...
A thermal interface material (TIM) is typically a compliant material with high thermal conductivity that is applied between a heat-generating chip and a heat spreader in an electronic package. For a high-conductivity polymeric TIM, the adhesion strength between the TIM and its mating interfaces is typically weak, making the TIM susceptible to degradation when subjected to environmental stresses. At...
The objective of this paper is focused on the hygroscopic swelling effect on polymeric material used in electronic package and thermo-hygro-structure coupled design and reliability analysis for finger printer package. For moisture absorption/desorption analysis, the ambient environment for temperature and humidity are set to be 60degC60%RH, 85degC60%RH and 85degC85%RH, respectively. The transient...
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