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The thermomechanical fatigue of solder joints on the system level is more complex to predict than on the board level. The damage of the solder joints of an electronic device in an ECU (electronic control unit) depends on the thermal expansion mismatch between the materials of the device and the PCB (printed circuit board), so called local mismatch, as well as on the global deformation of the PCB induced...
Drop/impact causes high strain rate deformation in solder joints of microelectronics package. It is important to understand mechanical behavior of solder joints under high strain rate for reliability design of products. In this paper mechanical behaviors of two lead-free solder alloys, Sn3.5Ag and Sn3.0Ag0.5Cu, were investigated by quasi-static tests and the split Hopkinson tension/pressure bar testing...
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