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In this work the investigation of copper-solder interface with Atomic Force Microscope (AFM) is presented. Multiple contact and tapping-mode AFM images were made on presoldered cross-sectional SAC (Sn-Ag-Cu) solder joint samples. The formation of oxide layer was observed and the structural properties of oxide were monitored in time. Our aim was to determine the maximum idle time between the sample...
The composition and thickness of surface oxide of solder particles has a direct effect on adhesion and electrical resistance of soldering joint and resultant the quality of interconnect and the reliability of packaged system. Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) were used...
A fluxless Cu/Sn SLID bonding process was demonstrated by using intermetallic Cu3Sn layer as the oxidation barrier for Cu interconnects. Oxidation behavior of intermetallic Cu3Sn was confirmed by aging Cu and multilayer Cu/Cu3Sn films at elevated temperatures in ambient air, and measuring the oxidation level by energy dispersive x-ray microscopy (EDX). The strength of bonded interconnects were characterized...
This paper considers the influence of 1) humidity and 2) acidic humidity on the growth of Sn whiskers. Sn whisker morphology was observed over a six-month period. The results show that the electroplated surfaces exposed to pure humidity are populated with Sn whiskers dimensionally smaller than surfaces exposed to acidic humidity. Variables analyzed include surface condition, Cu-Sn inter-metallic formation...
ldquoDevelopment for advanced thermoelectric conversion systemsrdquo supported by the new energy and industrial technology development organization (NEDO) has been successfully completed as one of the Japanese national energy conservation projects. Three types of the cascaded thermoelectric modules operating up to 850 K in high electrode temperature and two types of Bi-Te thermoelectric modules operating...
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