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This paper proposes a methodology to design radiation-hardened ICs, suitable for space applications and high-energy physics experiments. The miniaturization of ICs has brought an increase of circuit logic errors due to radiation, also at ground level. The increased complexity of IC design due to technology scaling requires new tools to design rad-hard circuits. In this paper, we propose a design tool...
With the continuous shrinking of the feature size, the effect of stress on the performance of the IC device and circuit can no longer be ignored. In fact, stress engineering is becoming more and more widely used today in advanced IC manufacture processes to improve device performance. Different from the intentionally introduced stresses to improve circuit performance, the shallow-trench-isolation...
Shorts and opens are the most common type of defects in digital integrated circuits ICs. They can affect interconnect wires connecting gates or transistors inside. Tools targeting the extraction of these potential defects focus only on the inter-gate bridging faults in order to use this information in pattern generation, and no one presents a method to extract potential intra-grate bridging fault,...
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