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Advances in micromachining technology can facilitate the integration of SAW (Surface Acoustic Wave) devices and CMOS circuitry on IC scale substrate for Monolithic fabrication. The optimal design and performance of these filters can be reached by using new Smart materials. The key component in the structure of the SAW device is the piezoelectric materials used which depends mainly on some important...
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
A novel compact coupled planar resonator (CCPR) based VCO (voltage controlled oscillator) using mode-coupling technique was developed in response to expensive high Ceramic and SAW resonators based signal source for wireless communications. One of the problems related to the conventional Ceramic/SAW based resonators (with high Q and low phase noise) is the challenge for integration in IC form. Instead...
The next generation of wireless communication is a ubiquitous radio system concept, providing wireless access from short-range to wide-area, with one single reconfigurable and adaptive system for all envisaged radio environments. This paper presents the design approach of RCO (reconfigurable concurrent oscillator) that simultaneously generates two or more signals of different frequencies that eliminate...
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