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Solid-liquid interdiffusion (SLID) interconnectsbased on Cu and Sn-solder are excellent candidates forstacking of Si chips in 3D integration. If the high-temperaturestable intermetallic compound (IMC) Cu3Sn is desired, themanufacturing of the interconnect can be very time consuming(long annealing time for growth of Cu3Sn). In this paper wepropose a method for the accelerated formation of Cu-Cu3Sn-Cu...
The n-type nonstoichiometric Pb0.55Te0.45 materials were prepared by melting and quenching combined with a subsequent high pressure high temperature (HPHT) treatment. After adequately annealed at 623 K in the argon atmosphere, the thermoelectric transport properties of the prepared samples have been systematically investigated. The results show that the pressure effectively adjusts the carrier concentration...
Integration of electronics into textiles has been a growing topic in recent years. However, a reliable contact between conductive textile structures and electronics modules is still an insufficiently solved problem. One approach is to embroider the conductive textile right to the electronics. This research describes the constitution of the electrical contact and explains resistance changes during...
The peculiarities of double frequency method for remote sensing liquid precipitation are discussed in monodisperse approximation. The rigorous calculations of electromagnetic waves scattering by dielectric spheres and properties of radar cross section are considered. The limits of method application are discussed as well as results of experiments.
Thermoelectric properties of ternary silver thallium tellurides: Ag8T12Te5 and AgT13Te2 were studied above room temperature to slightly below the melting temperature. As for Ag8T12Te5, the effects of Te content on the thermoelectric properties were also studied by characterizing the samples of Ag8T12Tex (x = 5.0, 5.1, 5.2). Both compounds show positive Seebeck coefficient (S). Ag8T12Te5 indicates...
The polycrystalline samples of BaSi2, SrSi2, and LaSi were prepared by spark plasma sintering (SPS). The electrical resistivity (rho) and Seebeck coefficient (S) were measured above room temperature. The S of BaSi2 was negative and the absolute values were rather high (-669 muVK-1 at 337 K). The S of SrSi2 was positive and the absolute values were lower (118 muVK-1 at 332 K) than those of BaSi2. For...
The SrTiO3 and Y-doped SrTiO3 polycrystalline sintered bodies were synthesized by the polymerized complex (PC) process and the subsequent hot pressing at 1473 K for 1 h or at 1673 K for 2 h in Ar atmosphere. The X-ray diffraction patterns of the SrTiO3 and Sr0.9Y0.1TiO3 samples synthesized by the PC process and hot pressing at 1473 K showed that these samples were mostly composed of the SrTiO3 single...
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