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An effective optimization approach for the electromigration (EM) reliability in power grid (PG) has been presented in this paper. With core technology development and the key feature size of integrated circuits decreasing, it is more serious for the EM-induced failure occurrence in the entire PG. However, previous PG studies focus on supply noise optimization and neglect the EM influence in lines,...
The majority of interconnects in an integrated circuit is composed of via-terminated segments that are connected to atomic sinks or reservoirs. In this paper, we investigate electromigration failure of Cu/low-k conductors with active (current carrying) sinks and reservoirs, as well as configurations where currents flow into or out of a common via. We show that when steady-state stress profiles are...
Over the years, there has been tremendous progress in developing new methods for modeling and diagnosing reliability at the level of individual transistors and interconnects. The thrust to propagate these models to higher levels of abstraction to predict the reliability of larger circuits is much more recent. This paper addresses the intersection of physics, circuits, and architecture for reliability...
Failures caused by the electromigration (EM) are becoming a primary reliability concern of integrated circuits and electronics packaging designers and manufacturers. In the foreseeable future, the trend of greater scale integration and further miniaturization in the microelectronics industry is expected to continue and this will make the metallization in electronics devices more susceptible to EM...
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