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The effect of thermal aging on the microstructure evolution and solder joint reliability in hard disk drive (HDD) under mechanical shock was investigated. Significant coarsening of Ag3 Sn particles was found in SnAgCu solder, and AuSn4 intermetallic compound (IMC) changed from needle-type to layer-type during aging. For as-soldered SnAgCu solder joints after mechanical shock, the cracks were initiated...
Recently, preventing environmental pollutions, Pb-free solders are about to replace Sn-Pb eutectic solders. Sn-Ag-Cu alloys are leading candidates for Pb-free solders. However, Sn-Ag-Cu alloys were not enough to meet severe board level reliability requirements. In particular, thermal fatigue failure still has the problem. The interfacial strength decreases with intermetallic compounds (IMC) formation...
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