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The interface of epoxy molding compound (EMC) and Cu is known to be one of the weakest points in the electronic package design. Self-assembly monolayer (SAM) has been suggested as adhesion promoter of EMC-Cu system. Due to the length scale issues, traditional finite element or Molecular dynamic simulation can not individually simulate the behavior of the EMC-SAM-Cu interface in electronic packages...
A set of experimental and computer simulation methods has been applied to reliability analysis of a newly designed resin transfer molded power electronics module for automotive applications, comprising the glass-fiber epoxy multi-layer PCB, populated with various electronic packages. Evaluation of thermo-mechanical stability, determination of moisture ingress, and testing the adhesion quality between...
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