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Flip chip packaging of ultra fine pitch integrated circuits (ICs) on organic substrates aggravates the stress-strain concerns, requiring a fundamentally different system approach to interconnections, underfill, interfaces, and the substrate. This work demonstrates a novel interconnection solution with excellent reliability for ultra-fine pitch (~30 mum) silicon (Si) on organic first level interconnections...
For maximizing space efficiency and reducing process steps, embedded chip-in-flex (CIF) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs) are one of the innovative packaging technology. This study was focused on the demonstration of CIF packages and their reliability evaluation. WLP was successfully performed in case of void-free ACF lamination on a 50 mum...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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